The article below discusses developments in 3D Flash NAND. Toshiba and Macronix have different approaches. See more details about Toshiba Next NAND- 3D with 15 Layers.
Applied material discusses processing issues and new equipment to address them.
"According to Applied Materials, building 3D NAND structures in like trying to dig a one-kilometer-deep, three-kilometer-long trench with walls exactly three meters apart, through interleaved rock strata."
Brian Bailey - November 15, 2012
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