Ron@Maltiel-consulting.com -  Semiconductor & Patent Expert Consulting                     

IP Litigation expert consultant and patent expert witness for process, device, and circuit of  Dynamic

 Ram (DRAM), Flash  (NAND, NOR, EEPROM), and Static Ram (SRAM) Memories,

 and Microprocessor, Logic, and Analog Devices

DDR3 New Products Validations, Shipments    

1.  Qimonda Starts Shipment of DDR3 Products

2. Micron announces its 78nm-made DDR3 validated with Intel -   Digital Times

3. Samsung claims largest number of DDR3 solutions validated by Intel

4. Elpida DDR3 memory receives Intel validation with reference G33 chipset platform

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1. Qimonda Starts Shipment of DDR3 Products to Manufacturers of High-Performance Motherboards and Overclocking Memory Modules - Qimonda DDR3 Memory Components and Modules Validated on Intel reference platforms

May 15, 2007 - Munich, Germany

Qimonda today announced that, as one of the first DRAM suppliers, it has started the shipment of new DDR3 components and modules to leading motherboard vendors and manufacturers of overclocking memory modules. In addition, Qimonda€™s next generation DDR3 DRAM products have been validated on Intel reference platforms.

Qimonda now offers 512Mb DDR3 SDRAM components and DDR3 unbuffered-DIMMs with 512MB and 1GB densities. These current devices support operating speeds of 800MHz, 1066MHz and 1333MHz and can even be overclocked to 1600MHz and beyond, making them the fastest devices in the industry as of today. Overclocking is a popular technique for getting more performance from a PC system for high-end applications like 3D gaming whereby the microprocessor or memory runs faster than the specified speed. This may increase system performance by up to 30%.

The new high-speed DDR3 components and modules underline Qimonda€™s technology leadership and aim to satisfy all needs of Personal Systems, including a wide range of desktop PCs, notebooks and workstations enabling data-intensive applications such as video editing and high-end gaming.

"Qimonda's DDR3 memory technology will enable Intel's desktop platforms to achieve higher performance, lower power and increased capacity in 2007," said Pete MacWilliams, Senior Fellow, Intel Corporation. "I expect DDR3 memory to be the key architecture for several years."

"Our DDR3-1333 devices deliver superior performance, bandwidth, and the modules show an extraordinary overclocking capability," said Michael Buckermann, Vice President of Business Unit Computing at Qimonda. €œThe validation of our DDR3 standard components and modules on Intel reference platforms demonstrates our technology leadership and shows that Qimonda is well positioned to serve this emerging market.€

Qimonda€™s DDR3 roadmap is focused to support the most important mainstream parts introducing densities of 512Mb and 1Gb first. Components with higher capacities are planned to follow. Qimonda€™s 512Mb DDR3 components in PG-TFBGA-78 packages are already available and are being shipped to customers. The volume production is planned for 2nd half of 2007. Unbuffered DIMMs with 512MB and 1GB densities (based on the 512Mb components) can be ordered now. The first generation DDR3 components have been developed jointly by Qimonda together with its partner Nanya. The DDR3 components and modules will also be exhibited at Computex Taipei (June 5-9, 2007) at Qimonda booths B726, 728, 825 and 827 in hall 1.

Further information on Qimonda€™s DDR3 products is available at: http://www.qimonda.com/computing-dram.
 

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2. Micron announces its 78nm-made DDR3 validated with Intel
Press release, May 14; Esther Lam, DIGITIMES [Tuesday 15 May 2007]

Micron Technology announced that its 1Gbit DDR3 have been validated with Intel desktop platforms.

This DDR3 is being fabricated on Micron's 78nm 6F process, which results a smaller die size premium over DDR2 compared with 512 megabit (Mb) products. offer lower power on modules that can utilize either 512Mb or 1Gb and meet the minimum system density requirements of 1GB.

Micron's DDR3 products support data rates of 800 megatransfers per second (MT/s) to 1,066 MT/s with clock frequencies of 400MHz to 533MHz, respectively, doubling the speed from DDR2. The DDR3 supply voltage has been reduced from 1.8V to 1.5V, reducing power consumption by up to 30%.

Evaluation samples of Micron's 1Gb DDR3 components are available to select customers with production expected to begin early next year. Micron's 1Gb DDR3 components will be available in various output configurations (x4, x8 and x16), and will be fully compliant with the most recent JEDEC DDR3 specifications. These components will support module densities from 512MB through 4GB and a variety of module types, including UDIMMs, SODIMMs, and RDIMMs.

A 2Gb DDR3 device is also expected to be available from Micron early next year, the company added.

 

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3. Samsung claims largest number of DDR3 solutions validated by Intel

Press release, May 14; Rodney Chan, DIGITIMES [Monday 14 May 2007]


Samsung Electronics has announced that 21 of its DDR3 solutions have been validated on Intel's reference platform to work with Intel's next generation (Bearlake) chipsets. This is the largest number of DDR3-based solutions to have passed the validation program.

Samsung's Intel-validated solutions include 13 modules and eight monolithic devices in combinations of 512Mb/1Gb densities with speeds of 800 or 1066Mb/s.

Samsung said it has worked very closely with Intel to develop the most advanced and comprehensive set of DDR3 memory solutions as early as possible in preparation for the next generation of Intel chipsets.

Samsung Electronics will exhibit at Microsoft's WinHEC 2007 Conference on May 14-15 a high-performance desktop PC installed with 8GB of memory, consisting of four 1333Mb/s 2GB DDR3 memory modules. This 1333Mb/s 8GB configuration is currently the fastest speed and largest density for a DDR3 chip, making it the optimal memory solution for PCs with advanced gaming features, said Samsung.

DDR3 memory will provide at least twice the bandwidth of today's primary memory- DDR2-with data transfer rates now up to 1.6Gb/s. This will enable much improved 3D graphics, which will directly benefit users of the new Windows Vista operating system.

DDR3 also improves the efficiency of multi-threading operations, which will enhance the performance of multi-core systems. DDR3 not only allows for higher system performance, but it also uses only 1.5V of power compared to the 1.8V of DDR2, thereby extending battery life in notebooks. To further optimize system thermal management, DDR3 modules can utilize a thermal sensor on the DIMM.

 

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4. Elpida DDR3 memory receives Intel validation with reference G33 chipset platform

Press release, May 14; Rodney Chan, DIGITIMES [Monday 14 May 2007]

Elpida Memory has received Intel's validation for its DDR3 main memory based on the G33 chipset (Bearlake) reference platform. The testing validates that Elpida's DDR3 memory can run on Intel's reference platform and recognizes the excellent quality and reliability of Elpida products, said the memory maker.

Since completing development of its DDR3 SDRAM in August 2005, Elpida has been delivering DIMM samples and developing high-speed, low-power circuit technologies. Elpida has taken advantage of its development of DDR3 memory to proceed with the start-up of the DDR3 memory platform based on close cooperation between Intel and Elpida which has already resulted in the shipment of tens of thousands of sample DIMMs to Intel for validation testing.

Elpida believes that securing the Intel validation has demonstrated that it can quickly enable its next-generation DDR3 memory platform.

The first application of DDR3 memory will be in high-end desktop PCs but is likely to later replace DDR2 memory in notebook PCs and servers.

Elpida is now shipping SO-DIMMs for notebook PCs and is preparing for volume shipments of registered DIMMs for servers by making this product available to chipset vendors and major customers for evaluation.

Also, not only has the DDR3-1066 received Intel's validation but also operations of DDR3-1333 have been confirmed. The 1Gbit DDR3 memory using 70nm process technology will be coming soon, and will enable higher speed products like the DDR3-1600.

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