2015

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• SSD, 3D Vertical NAND, or 3D XPoint?
• DRAM Market Consolidation ⇒32% Growth, All-Time High Revenue
• 3D Flash NAND, SSD Challenges
• SSD Controllers, Still Secret Sauce (Silicon Motion)
• NAND Flash, DRAM 2015 Trends
• Samsung, Apple in DRAM, NAND, SSD Marketplace

2014

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• Samsung's 3D NAND Teardown, Patent
• 3D Flash Race: Intel vs. Samsung
• Samsung 3D Process Pioneers Next Gen Semiconductor Devices
• SanDisk ULLtraDIMM Gaining Traction
• Die Size, NAND, DRAM 3D Roadmaps
• Bottlenecks: DRAM & Moore's Law
• DRAM as Non-Volatile Memory ⇒ Longer Battery Life
• Will NAND DIMMs Take Off?
• 3D NAND and TSV Process
• Apple 64 bits, Mobile DRAM Market, and Masking Lithography
• 16nm Split Gate NV (Non Volatile) Memory Cell Advance
• Flash NAND, NOR, eMMC Market Growth

2013

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• 3D Semiconductors — TSV with DRAM Memory
• Facebook: Flash Storage in Database
• DDR4 — Latest DRAM is Here
• Facebook Propels SSD Flash Storage
• Samsung 3D Stacked NAND Flash has Engineering Samples
• Samsung’s 1Tb SSD: 3D Vertical NAND
• Server Storage 85% Faster without PCI Express
• SanDisk and 3D NAND
• SSD and NAND Shortage in 2013
• Samsung NAND 1xnm Manufacturing TLC (Triple Level)
• Tablets, Smartphones, and SSDs Share of NAND Market in 2013
• Storage Memory Tipping Point
• Integrating Flash in DDR4 DIMMs
• MLC Flash Memory New Future
• 3D Flash Memory Marching Forward
• ​Radically Extending Cycling Endurance of Flash Memory Past 100M Cycles
• ​Flash Memory Sales Surpass DRAM
  
• ISSCC 2013 Memory Trends: Flash, NAND, and DRAM
  
  

2012

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• Samsung Advances Memory Storage eMMC to 1x-nm Process
• Mobile DRAM Takes Over
• iPad, iPhone, and Tablets ⇒ Flash, DRAM Markets Crosscurrents
• Flash Memory Sales Surpass DRAM
• IBM Acquires Texas Memory (SSD Vendor)
• Microsoft: Million+ PC, Laptop, DRAM Failures
• 2012 Q1 Ranking: Toshiba Outperforms NAND Market​
• Q4 '11 NAND Flash Ranking, Can We Trust the Numbers?
• Apple NAND Storage in Upcoming MacBook Pros
• Flash, DRAM Memory Impact Smartphone Design
• ​Hynix Next Gen. NAND Flash
• Smartphone Components Cost; NAND Flash, Display, DRAM
• Simon Sze Inventor Floating Gate Non-Volatile Memory (NVM)
• First DDR4 DRAM from Micron
• Flash is Not Just About Storage
• Real Growth Paths for Flash Memory
• When will the Flash be 2x DRAM Memory Market?
• Is Resistive RAM (RRAM) The Future Flash Memory?
• Intel / Micron 20-nm 64G MLC NAND Flash Memory Reverse Engineered
• iPad Teardown — Flash NAND Memory is a Major Profit Source
• ​Samsung Unveils 10nm-class (10-19nm) Embedded Memory Card
• Flash to 'Checkmate' Hard Drives by 2020, Next DRAM
• Samsung Develops Faster DRAM Chips for Next-gen Mobile Devices
  
• Samsung Develops Superfast Mobile DRAM​​

2011

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• Non-Volatile Flash Memory Basic
• Flash Memory Controller is the Secret Sauce
• Flash Summit 2011: New Insights Into the Future of NAND Flash, Top 10 Lists Trends
• Flash Memory Summit 2011: Fusion-io, STEC, and Other Presentations
  

2009

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• Samsung Buying Sandisk?
  
• ​DRAM and NAND Q1 2009 Market Shares
• Long-Term Trends in the NOR and NAND Markets
• Fusion-io Super Fast NAND Flash Storage Using PCIe for Enterprise Market
• DRAM Ranking for Q3 2009

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• SanDisk's ExtremeFFS — New Flash Management System for Improving SSD Performance and Reliability
• NAND for Mobile Handsets: Cost, Density, and Performance Advantages
• Non-Volatile Memory Host Controller Interface (NVMHCI)
• Flash Memory and SSD Reliability — Comments by Intel and Samsung
• Intel, Micron New ONFi 2.0 Interface Boost the Data Transfer Rate of NAND Flash-Memory 5x
• Samsung, Toshiba Share OneNAND and LBA-NAND Flash Specs to Improve Supply Availability
• Intel and STMicroelectronics Shipping Functional Prototype of Phase-Change Memory (PCM)
• ​Rambus Demonstrates Terabyte Memories Using Fast Channels
• Toshiba's Logical Block Addressing (LBA) Interface for NAND Flash Reportedly has Received Support from Samsung Against ONFI
• PCs Crash Due to Single-bit DRAM Errors and Can be Solved Using ECC — According to Microsoft
• DDR3 New Product Validation, Shipments by Qimonda, Micron, Samsung, and Elpida
• Mosaid Claims New Flash Interface Offers 10x Boost
• Hynix Received Validation on its DDR3 Memory Components and Modules from Intel
• Qimonda and Micron Technology Delivered Samples of Next-Generation DDR3 DRAM Ahead of Samsung Electronics
• PCM and FRAM Products Introduction
• Hynix Introduces 512Mb Mobile DDR with ECC Support
• Renesas and Matsushita Develop Circuits to Stabilize SRAM Operation in Embedded Control Applications on 45nm Technology
• Open NAND Flash Interface (ONFI) Group Introduced a Chip-level Interface Standard for NAND Flash Memory